Data SheetGlass surfaces can be precisely structured and modified. Fast AOM-based modulation enables highly controlled energy delivery for polishing, shaping, and microstructuring, improving surface quality while minimizing thermal impact and eliminating secondary finishing steps.
Technical Data
| Performance | |
|---|---|
| Output Power | 120 W |
| Wavelength | 9.3 µm / 9.6 µm / 10.6 µm |
| Modulation Frequency | up to 1 MHz |
| Rise/Fall Time | <400 ns |
| Power Stability | ±2% |
| Mechanical | |
| Dimensions (L × W × H) | 855 × 260 × 205 mm |
| Weight | 48 kg |
| Utilities | |
| Voltage | 48 VDC |
| Cooling | Water |
ALX100-AO Laser
Stable slab CO₂ laser for precision processing
The ALX100-AO combines high stability with high-speed acousto-optic modulation to enable precise and reproducible processing of sensitive materials such as thin films, glass, and electronic components.
High process stability
Stable slab design ensures highly consistent output after warm-up, with <2% power stability after 10 minutes, supporting reproducible results in demanding environments.
Fast pulse control
Integrated AOM enables fast pulse shaping and precise energy control, with <400 ns rise/fall times and modulation up to 1 MHz.
High processing throughput
Wide dynamic range (0–100% amplitude control) enables process optimization for each material and feature size, supporting fast and efficient material processing without compromising precision.
Optimized for delicate materials
Controlled energy deposition minimizes heat-affected zones to tens of micrometers, making the system ideal for thin films and temperature-sensitive materials.
Lower cost of ownership
Extended gas lifetime and on-site refill capability reduce maintenance effort and minimize downtime, supporting lower total cost of ownership.
Downloads of Popular Configurations
Glass & Optical Processing
Thin-Film Cutting
Thin-film materials and multilayer display stacks can be processed with high precision. The CO₂ wavelength enables controlled cutting, trimming, and half-cut structuring of sensitive layers, producing clean edges while minimizing damage to adjacent material in display and electronics applications.
Electronic Components
Electronic substrates and insulating layers can be processed with high precision. The CO₂ wavelength enables controlled via formation and selective structuring of dielectric materials, supporting clean, repeatable processing in PCB, ceramic, and advanced electronic interconnect applications.
