Data SheetGlass surfaces can be precisely structured and modified. Fast AOM-based modulation enables highly controlled energy delivery for polishing, shaping, and microstructuring, improving surface quality while minimizing thermal impact and eliminating secondary finishing steps.
Technical Data
| Performance | |
|---|---|
| Output Power | 120 W |
| Wavelength | 9.3 µm / 9.6 µm / 10.6 µm |
| Modulation Frequency | up to 1 MHz |
| Rise/Fall Time | <400 ns |
| Power Stability | ±2% |
| Mechanical | |
| Dimensions (L × W × H) | 855 × 260 × 205 mm |
| Weight | 48 kg |
| Utilities | |
| Voltage | 48 VDC |
| Cooling | Water |
ALX100-AO Laser
Stable slab CO₂ laser for precision processing
The ALX100-AO combines high stability with high-speed acousto-optic modulation to enable precise and reproducible processing of sensitive materials such as thin films, glass, and electronic components.
High process stability
Stable slab design ensures highly consistent output after warm-up, with <2% power stability after 10 minutes, supporting reproducible results in demanding environments.
Fast pulse control
Integrated AOM enables fast pulse shaping and precise energy control, with <400 ns rise/fall times and modulation up to 1 MHz.
High processing throughput
Wide dynamic range (0–100% amplitude control) enables process optimization for each material and feature size, supporting fast and efficient material processing without compromising precision.
Optimized for delicate materials
Controlled energy deposition minimizes heat-affected zones to tens of micrometers, making the system ideal for thin films and temperature-sensitive materials.
Lower cost of ownership
Extended gas lifetime and on-site refill capability reduce maintenance effort and minimize downtime, supporting lower total cost of ownership.
Downloads of Popular Configurations
Glass & Optical Processing
Organic Material Cutting
Organic materials strongly absorb the CO₂ wavelength, enabling efficient and gentle processing. Precise energy control allows clean cutting and structuring, producing defined edges while preserving material integrity in delicate or heat-sensitive substrates.
Ceramic Ablation
Technical ceramics and coated substrates can be selectively processed with precise energy control. Functional layers can be structured or trimmed with consistent results, supporting electronics applications while maintaining material integrity and minimizing thermal stress.
PCB / Thin-Film Cutting
Flexible printed circuit boards and polymer-based substrates can be efficiently processed. The CO₂ wavelength enables precise cutting and structuring of insulating layers, producing clean edges while minimizing thermal impact in electronics and medical device applications.
Wood Cutting
Natural materials such as wood can be processed with high precision. Optimized energy delivery enables clean cutting and fine structuring with minimal charring, supporting detailed features and high edge quality without additional finishing steps.
